| PART |
Description |
Maker |
| CDR11BP100AGYS CDR11BP101AGYS CDR11BP102AGYS CDR11 |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.001 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.00075 uF, SURFACE MOUNT CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000075 uF, SURFACE MOUNT CHIP
CAP 2200PF 50V 5% X7R SMD-1111 WAFFLE-PAK BASE/BARR/SOLDER MICROWAVE R-MIL-PRF-55681 CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0022 uF, SURFACE MOUNT
|
AVX, Corp.
|
| 0805B201M601YHT 0805B122M601YHT 0805B121M601YHT 08 |
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0002 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0012 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00012 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0015 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0011 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0013 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.002 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0016 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.001 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00016 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00018 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00013 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.00015 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 600 V, X7R, 0.0018 uF, SURFACE MOUNT, 0805 CHIP
|
Novacap
|
| 05006-BP1R2CDU-R 05006-BP1R5CDU-R 05006-BP1R8ADU-R |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000012 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000015 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000018 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000001 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000022 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000005 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.000082 uF, SURFACE MOUNT, 0805 CHIP, HALOGEN FREE AND ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BP, 0.0000082 uF, SURFACE MOUNT, 0805 CHIP, HALOGEN FREE AND ROHS COMPLIANT
|
Vishay Intertechnology, Inc.
|
| LDB211G9020C-001 LDB21906M20C-001 LDB21906M05C-001 |
Chip Multilayer Hybrid Baluns 1800 MHz - 2000 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 887 MHz - 925 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 800 MHz - 1000 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 1500 MHz - 1700 MHz RF TRANSFORMER
Chip Multilayer Hybrid Baluns 1600 MHz - 1800 MHz RF TRANSFORMER
|
Murata Manufacturing Co., Ltd.
|
| HKQ040211NH-E |
High-Q Multilayer Chip Inductors for High Frequency Applications (HK series Q type)
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ04024N7J-T |
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|
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|
| HKQ04020N9C-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
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|
| HKQ04023N6B-T |
High-Q Multilayer Chip Inductors for High Frequency Applications
|
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|
| HKQ0603W5N1J-T |
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|
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|
| HKQ0603C3N8C-T |
High-Q Multilayer Chip Inductors for High Frequency
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W2N4C-T |
High-Q Multilayer Chip Inductors for High Frequency
|
Taiyo Yuden (U.S.A.), I...
|
| HKQ0603W2N9C-T |
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|
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|
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